|
| Brand Name: | HSTECH |
| Model Number: | HS-D331AB |
| MOQ: | 1 pc |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100pcs per week |
Customizable Glue Mixing Ratio Glue Dispensing Machine for Wall Sphere
Specification
| ITEM | SPEC |
| Glue Mixing Ratio | 1:1-10:1/Customizable |
| Dispensing Speed | 10-150g/5s(based on 1:1 glue proportion) |
| Dispensing Precision | Glue Amount±1%, Glue Proportion±1% |
| X/Y/Z Working Range | 300*300*100mm(Z axis can be rotated) |
| XYZ Speed | Max 300mm/s |
| Drive System | Stepping Motor + Timing Belt |
| Repeatability | ±0.02mm |
| Pattern | Lines, Circles, Arcs, Continuous Paths, 3D Linear Interpolation |
| Potting Precision | Amount±1%, Ratio:±1% |
| Operation Method | Auto |
| Programming | Teach Pendant |
| Control | Board card |
| Leak-proof Function | Valve with Vacuum Device |
| Weight | 65kg |
| Dimension(L*W*H) | 716*585*645mm |
| Power Supply | 220V 50-60Hz 350W |
This equipment is designed for high efficiency and high precision dispensing production process, widely used in all kinds of products dispensing needs. Its application fields include but are not limited to sensors, relays, power adapters, electronic toys, sounders, electronic components, household appliances, electric vehicle controllers, computer digital products, arts and crafts, mobile phone board, coil products, key products, battery boxes, speakers of the point bonding; In addition, it is especially suitable for speaker packaging and dispensing, optical semiconductor packaging, mobile phone battery and notebook battery packaging, PCB board bonding, COB, IC, PDA, LCD packaging and other processes; Whether it is IC packaging, IC bonding, chassis bonding, optical device processing, hardware parts packaging coating, quantitative liquid filling, chip bonding, and even automotive mechanical parts coating and mechanical sealing, this equipment can efficiently and accurately complete the dispensing operation to meet various production needs.
