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| Brand Name: | HSTECH |
| Model Number: | HS-D331AB |
| MOQ: | 1 pc |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100pcs per week |
Customizable Glue Mixing Ratio Glue Dispensing Machine for Wall Sphere
Specification
| ITEM | SPEC |
| Glue Mixing Ratio | 1:1-10:1/Customizable |
| Dispensing Speed | 10-150g/5s(based on 1:1 glue proportion) |
| Dispensing Precision | Glue Amount±1%, Glue Proportion±1% |
| X/Y/Z Working Range | 300*300*100mm(Z axis can be rotated) |
| XYZ Speed | Max 300mm/s |
| Drive System | Stepping Motor + Timing Belt |
| Repeatability | ±0.02mm |
| Pattern | Lines, Circles, Arcs, Continuous Paths, 3D Linear Interpolation |
| Potting Precision | Amount±1%, Ratio:±1% |
| Operation Method | Auto |
| Programming | Teach Pendant |
| Control | Board card |
| Leak-proof Function | Valve with Vacuum Device |
| Weight | 65kg |
| Dimension(L*W*H) | 716*585*645mm |
| Power Supply | 220V 50-60Hz 350W |
This equipment is suitable for high efficiency, high running precision and production process of dispensing. Generally suitable for products with sensors, relays, power adapters, electronic toys, sounders, electronic components, household appliances, electric vehicle controllers, computer digital products, crafts, mobile phone boards, coil products, button products,battery boxes, speakers Dot glue bonding; speaker packaging and dispensing, optical semiconductor, mobile phone battery, laptop battery packaging, PCB board bonding, COB, IC, PDA, LCD sealing, IC packaging, IC bonding, chassis bonding, Optical device processing, hardware parts package coating, quantitative liquid filling, chip bonding, automotive mechanical parts coating,mechanical seals, etc.
