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Solder Paste Machine
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High-Performance Solder Paste Machine For Industrial 4.0 MES System

High-Performance Solder Paste Machine For Industrial 4.0 MES System

Brand Name: GKG
Model Number: G9+
MOQ: 1 set
Price: Negotiation
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE,TUV,ROHS
Product Name:
High-end Solder Paste Printing Machine
Other Name:
Automatic Screen Printing Machine
PCB Size:
50x50~450x340mm
Transport Height:
900±40mm
Air Pressure:
4-6kgf/cm³
PCB Thickness:
0.4-6mm
Max Board Weight:
5kg
Machine Weight:
1000kg
Packaging Details:
Wooden Package
Supply Ability:
100 sets per month
Highlight:

High Performance Solder Paste Machine

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MES System Solder Paste Machine

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Industrial 4.0 Solder Paste Machine

Product Description

Automatic Solder Paste Printer for Industrial 4.0 MES System

 

Specification

 

Model G9+
Max PCB Size 450x340mm
Min PCB size 50x50mm
PCB thickness 0.4-6mm
Max board weight 5kg
Transport height 900±40mm
Board edge gap 2.5mm
Board height 15mm
Transport direction L-R,R-L
Transport speed max 1500mm/s, program control
Transport method One stage
WIdth adjustment automatic
I/O interface SMEMA
PCB positioning (support method) Magnetic pin/support block/manual up-down table
PCB clamping system
Patented over the top clamping
Side clamping
Adsorption function
Print snap-off
0-20mm
Print mode
one/twice
Print Speed
10-200mm/sec
Print Mode
One /Twice
Squeegee Type
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure 0.5-10kg
Template fram size 470*370mm~737*737mm(20-40thickness)
Cleaning System
Droops of rain type cleaning system
Reinforced vacuum absorption
Dry, wet vacuum three modes
Back and forth cleaning
CCD FOV
10x8mm
Fiducial mark types Standard Fiducial mark shape
Pad
Hole
Camera system Look up/down optics structure
CCD digital camera
Geometry pattern match

 

Features

 

  1. The CCD digital system features an entirely new optical path design, offering uniform circular lighting and high-brightness coaxial illumination. With adjustable brightness in an infinite loop for both light source systems, it effortlessly recognizes various mark points, including uneven ones on tin-plated, copper-plated, silver-plated surfaces, hot-air soldering points, FPCs, and PCBs of different colors.

  2. It boasts high-precision PCB thickness adjustment and a robust structure ensuring stable XY movement. Manual adjustments make accommodating different PCB thicknesses a breeze.

  3. The guide rail positioning system includes a detachable new pattern guide rail and a programmable flexible side clamp, specifically designed for FPCs and warped PCBs. A unique clamping plate device, controlled by software programming, automatically adjusts to accommodate various PCB thicknesses without issue.

  4. The innovative squeegee structure design incorporates a comprehensive squeegee system, enhancing stability and extending the squeegee's lifespan.

  5. The high-speed stencil cleaning system features a downward dispensing cleaning structure, preventing clogged openings—a common cause of ineffective cleaning. The solvent dispense length can be easily adjusted via software control.

  6. The new multi-function interface is user-friendly, intuitive, and simple to understand. It also includes real-time temperature and humidity monitoring.

 
High-Performance Solder Paste Machine For Industrial 4.0 MES System 0
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