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| Brand Name: | HSTECH |
| Model Number: | HS-700 |
| MOQ: | 1 set |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100 sets per month |
Stepping Motor CCD Color Align System PCB Handling Equipment for BGA Rework Station
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Advantages
1.Optical alignment system
High-definition CCD (2 million) digital imaging, automatic optical zoom system, manual control with laser red dot alignment.
2.Imported heating core
Adopting imported heating core, fast heating, high precision temperature control, longer service life.
3.Real-time temperature monitoring
Real-time temperature display with automatic curve analysis function.
4.Fast heating and cooling
IR preheating zone with medium wave ceramic infrared heating, multi-functional movable PCB fixing bracket and BGA bottom support bracket, laminar flow integrated cooling fan.
About Packaging
