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| Brand Name: | HSTECH |
| Model Number: | HS-700 |
| MOQ: | 1 set |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100 sets per month |
CCD Color Align System PCB Handling Equipment for High Precision BGA Rework and Repair
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Features
1.5 working modes
2.15 high-definition LCD display
3.7 high-definition color touch screen
4. Stepper motor
5. CCD color optical alignment system
6. Temperature accuracy within ± 1 ℃
7. Installation accuracy within ± 0.01mm
8. Repair success rate: 99%+
9. Independently developed microcontroller control
About Packaging
COMPANY PROFILE
