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| Brand Name: | HSTECH |
| Model Number: | HS-800 |
| MOQ: | 1 set |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100 sets per month |
High Precision Stepping Motor CCD Color Align System for Mobile Phone BGA Rework
Specification
| BGA Rework Station | Model:HS-800 |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Bottom Pre-Heating | IR 5000w |
| Temperature control | K-type thermocouple,close loop control |
| Locating way | Outer or location hole |
| Overall dimension | L970mm*W700mm*H830mm |
| PCB size | W650*D610mm |
| BGA size | Max 80mm*80mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 140KG |
Features
1.Hot air head and mounting head integration design, with auto soldering and desoldering functions.
2.Upper heaters adopt hot air system, heating faster, temperature evenness, cooling faster. (the temperature can be up to 50 to 80 centigrade).
3.Independent 3 heaters. upper and lower heaters can realize move synchronously and automatically, can reach IR every position. Lower heater zone can remove up and down, support PCB board.
4.PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.
5.Unique bottom preheating table made of Germany-imported good quality heating materials plated.
6.Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
7.X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient.
8. Double rocker control the camera and upper and lower heating platform to make sure the alignment precision accuracy.
9.Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.
10.Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.
11.Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; reworkable max. BGA size 80*80MM;
Application
Suitable for mobile phones, hard drives, keyboards, electronic toys, computers, DVD, dots, plastics, electrical appliances, communication equipment, electrical appliances, toys, electronic processing, motors, motors, parts, tablets, notebook computers, digital cameras, remote controls, walkie-talkie, etc.
About Packaging
