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7''HD color Touch Scree Mobile Phone BGA Rework Station with Stepping Motor

7''HD color Touch Scree Mobile Phone BGA Rework Station with Stepping Motor

Brand Name: HSTECH
Model Number: HS-700
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE
Product Name:
Mobile Phone BGA Rework Station
Warranty:
1 Year
Control:
Touch Screen
Material:
Aluminum Alloy
Thickness:
0.3 - 5mm
Total Power:
2600W
Power Supply:
AC220V
Weight:
30KG
Packaging Details:
Wooden package
Supply Ability:
100 sets per month
Product Description

15''HD LCD monitor Mobile Phone BGA Rework Station with 5 Modes Stepping Motor CCD Color

 

Introduction:

 

A Mobile Phone BGA Rework Station is a specialized piece of equipment designed for repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable devices.

 

Features:

1. 5 work modes

2. 15''HD LCD monitor

3. 7''HD color touch screen

4. stepping motor

5. CCD color optical alignment system

6.Temperature accuracy within ±1℃

7.Mounting precision within ±0.01mm

8.Repair success rate: 99% +

9. Independent research and development of single-chip control

 

​Specification:

 

Mobile Phone BGA Rework Station Model:HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total power 2600W
Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
Electric material Driving motor + smart temp. controller + color touch screen
Temperature control high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
Sensor 1pcs
Locating way V shape PCB support + external universal fixture + laser light for centering and positioning
Overall dimension L450mm*W470mm*H670mm
PCB size Max 140mm*160mm Min 5mm*5mm
BGA size Max 50mm*50mm Min 1mm*1mm
Applicable PCB thickness 0.3 - 5mm
Mounting accuracy ±0.01mm
Weight of machine 30KG
Mount chip weight 150g
Working modes Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair chips / phone motherboard etc

Applications

  1. Mobile Phone Repair:

    • Primarily used for repairing smartphones that have BGA components, such as processors, memory chips, and graphics chips.
  2. Consumer Electronics:

    • Applicable in the repair of other consumer electronics that utilize BGA technology, including tablets, laptops, and gaming consoles.
  3. Prototyping and Development:

    • Used in research and development environments for prototyping new circuit designs that incorporate BGA packages.
  4. Quality Control:

    • Employed in quality assurance processes to rework defective components before final assembly.

Advantages

  1. Enhanced Repair Efficiency:

    • Speeds up the rework process, allowing technicians to handle multiple repairs quickly and efficiently.
  2. Cost-Effective:

    • Extends the life of devices by enabling the repair of expensive BGA components rather than replacing the entire board.
  3. Improved Precision:

    • Advanced technology allows for high-precision repairs, reducing the risk of damage to adjacent components.
  4. Flexibility:

    • Suitable for a wide range of BGA sizes and types, making it versatile for different repair tasks.
  5. User Training and Support:

    • Many manufacturers provide training and support, helping technicians to effectively use the equipment and improve their repair skills.

 

5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station 0

5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station 1