Brand Name: | HSTECH |
Model Number: | HS-700 |
MOQ: | 1 set |
Price: | Negotiable |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 100 sets per month |
15''HD LCD monitor Mobile Phone BGA Rework Station with 5 Modes Stepping Motor CCD Color
Introduction:
A Mobile Phone BGA Rework Station is a specialized piece of equipment designed for repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable devices.
Features:
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Specification:
Mobile Phone BGA Rework Station | Model:HS-700 |
Power Supply | AC 100V / 220V±10% 50/60Hz |
Total power | 2600W |
Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
Electric material | Driving motor + smart temp. controller + color touch screen |
Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
Sensor | 1pcs |
Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
Overall dimension | L450mm*W470mm*H670mm |
PCB size | Max 140mm*160mm Min 5mm*5mm |
BGA size | Max 50mm*50mm Min 1mm*1mm |
Applicable PCB thickness | 0.3 - 5mm |
Mounting accuracy | ±0.01mm |
Weight of machine | 30KG |
Mount chip weight | 150g |
Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
Usage Repair | chips / phone motherboard etc |
Mobile Phone Repair:
Consumer Electronics:
Prototyping and Development:
Quality Control:
Enhanced Repair Efficiency:
Cost-Effective:
Improved Precision:
Flexibility:
User Training and Support: