JUKI2000 SMT Nozzle 503 E36027290A0 Materials Eco-Friendly Design Precision Placement Ideal

Compatible with JUKI2000 Chip Shooter Silver and Green Color 503 E36027290A0

Introduction

This 503 nozzle type is compatible with the JUKI2000 Series chip mounter. Constructed from a combination of ceramic, tungsten steel, and rubber, it is ideal for placing various components such as cathode capacitors, diodes, SOTs, QFNs, BGAs, and more.

Specifications

Features

1. Constructed with premium materials like ceramic, tungsten steel, and rubber, it ensures exceptional mounting performance and extended durability.
2. The nozzles are safely enclosed in customized blister packs to safeguard against any damage during transportation.
3. Featuring standard sizing and zero error tolerance, it assures high precision in its operations.
4. Available in eco-friendly green and silver colors, it not only looks appealing but also aligns with environmental conservation principles.
5. Perfect for the suction and placement of various components, including cathode capacitors, diodes, SOTs, QFNs, BGAs, and additional types.

JUKI 2000 Series nozzle models

E36087290A0 JUKI NOZZLE 500 ASSY.1.0×0.5
E36007290A0 JUKI NOZZLE 501 ASSEMBLY 0.7×0.4
E36017290A0 JUKI NOZZLE 502 ASSEMBLY O 0.7/O 0.4
E36027290A0 JUKI NOZZLE 503 ASSEMBLY O 1.0/O 0.6
E36037290A0 JUKI NOZZLE 504 ASSEMBLY O 1.6/O 1.0
E36047290A0 JUKI NOZZLE 505 ASSEMBLY O 3.5/O 1.7
E36057290A0 JUKI NOZZLE 506 ASSEMBLY O 5.0/O 3.2
E36067290A0 JUKI NOZZLE 507 ASSEMBLY O 8.5/O 5.0
E36077290A0 JUKI NOZZLE 508 ASSEMBLY O 9.5/O 8.0
 

SMT production line equipment:

1. SMD Machine: This equipment, programmed for precise component placement, is capable of handling SOP 28-pin or higher components (even those mounted by high-speed machines), which are supplied in rolls, discs, or tubes. It stands out for its high mounting accuracy and versatility, albeit operating at a slower pace compared to high-speed machines.

2. Reflow Soldering: This process entails utilizing SMT solder paste or red glue and establishing a suitable temperature profile to guarantee that the solder paste and components undergo complete welding.

3. Unloader: The conveyor track conveys the board to be collected in the magazine.