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| Brand Name: | JUKI |
| Model Number: | JUKI 503 KE2000 series |
| MOQ: | 5pc |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 10000 pcs per month |
Compatible with JUKI2000 Chip Shooter Silver and Green Color 503 E36027290A0
Introduction
This 503 nozzle type is compatible with the JUKI2000 Series chip mounter. Constructed from a combination of ceramic, tungsten steel, and rubber, it is ideal for placing various components such as cathode capacitors, diodes, SOTs, QFNs, BGAs, and more.
Specifications
| Brand | JUKI |
| Parts number | E36027290A0 |
| Model number | M3180301021 |
| Nozzle type | 503 |
| Chip mounter | 20000series |
| Nozzle size | 31x16mm / 1.22x0.63 inch(Height x Diameter) |
| Nozzle color | Sliver and green |
| Material | Tungsten steel |
| Weight | 8g/0.353 ounces |
| Package | Customized Blister |
Features
Crafted from high-quality materials including ceramic, tungsten steel, and rubber, it offers superior mounting performance and a prolonged lifespan.
The nozzles are securely packaged in customized blister packs to prevent any damage during shipment.
With standard sizing and zero tolerance for errors, it guarantees high precision.
Designed in eco-friendly green and silver hues, it boasts an appealing appearance while adhering to environmental protection principles.
Ideal for the suction and placement of components such as cathode capacitors, diodes, SOTs, QFNs, BGAs, and more.
JUKI 2000 Series nozzle models
E36087290A0 JUKI NOZZLE 500 ASSY.1.0×0.5
E36007290A0 JUKI NOZZLE 501 ASSEMBLY 0.7×0.4
E36017290A0 JUKI NOZZLE 502 ASSEMBLY O 0.7/O 0.4
E36027290A0 JUKI NOZZLE 503 ASSEMBLY O 1.0/O 0.6
E36037290A0 JUKI NOZZLE 504 ASSEMBLY O 1.6/O 1.0
E36047290A0 JUKI NOZZLE 505 ASSEMBLY O 3.5/O 1.7
E36057290A0 JUKI NOZZLE 506 ASSEMBLY O 5.0/O 3.2
E36067290A0 JUKI NOZZLE 507 ASSEMBLY O 8.5/O 5.0
E36077290A0 JUKI NOZZLE 508 ASSEMBLY O 9.5/O 8.0
SMT production line equipment:
SMD Machine: This equipment, programmed to place components on designated positions, can handle SOP 28-pin or higher components (including those mounted by high-speed machines), which come in rolls, discs, or tubes. It is characterized by high mounting accuracy and versatility but operates at a speed slower than high-speed machines.
Reflow Soldering: This process involves using SMT solder paste or red glue and setting an appropriate temperature profile to ensure that the solder paste and components complete the welding action.
Unloader: The board is collected in the magazine via the conveyor track.
