Touch Screen Panel Control Using D.I Water SMT Chip Mounter Nozzle Cleaner

Touch Screen Panel Control Using D.I Water SMT Chip Mounter Nozzle Cleaner

Introduce

The nozzle cleaning machine is a cleaning equipment that replaces the traditional use of steel needles or ultrasonic vibration to clean the nozzles. The dirt on the suction nozzle that could not be removed before can be removed in a short time. And the nozzle will not be damaged during the cleaning process. Since it uses non-toxic and harmless cleaning fluid, the whole process is more environmentally friendly.

Automatic Nozzle Cleaning System. With the development of SMT, miniaturization and high-density mounting of components have become a trend. Subsequently, the nozzle of the SMT placement machine is more precise and has a greater impact on placement quality. During the actual mounting process, the nozzle is clogged due to contamination of solder, flux or other contaminants, which can easily cause material to be thrown away. Previously, we could no longer solve the problem by poking with steel needles or using ultrasonic shock.

The nozzle cleaning machine developed for this situation uses a new cleaning method, which can remove dirt on the nozzles that could not be removed in a short time. And the nozzle will not be damaged during cleaning. Since non-toxic and harmless cleaning fluid is used, the whole process is more environmentally friendly.

Advantage

1. Miniaturization of components: The rapid development of the electronics industry has made components increasingly miniaturized. 0402 and 0201 components are becoming more common and widely used, and smaller components will soon appear.

2. Smaller spacing: Electronic equipment requires smaller size and more powerful functions, so the components on the circuit board are getting denser and denser, and the spacing is getting smaller and smaller. If in the past, a slight flatness difference during patching would not have a big impact. Otherwise, it may step into the neighbor's territory, resulting in an increase in the defective rate of products.

3. Impact of lead-free: Due to the good activity of lead, if there is a slight deviation in the patch, it can be corrected after reflow soldering.

However, after lead-free, the activity of copper is greatly weakened. If there is a deviation in the patch, then the There is no chance for correction.

4. In summary, the chip placement accuracy is required to be higher and higher, and a slight difference may lead to a huge difference. The design accuracy of the placement machine is already quite high, but its performance is greatly compromised due to various factors, among which the uncleanness of the suction nozzle is also an important factor.

Economic benefits:

1. Reduce the purchase cost of nozzles

2. Reduce unnecessary labor

3. Improve SMT production efficiency

4.Reduce the product defect rate. Dirty suction nozzles and weak suction can easily cause component sliding and material throwing, resulting in an increase in the product defect rate.

Specification

About Packaging