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| Brand Name: | FUJI |
| Model Number: | NXT H08M |
| MOQ: | 1 PC |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 10000 pcs per month |
SMT (Surface Mount Technology) nozzle is an important tool used in automated placement equipment for electronic components, used to pick up and place small electronic components. There are many types of SMT nozzles according to different needs, common ones include:
| Round nozzle | The round nozzle is the most common type, suitable for picking up and placing round electronic components, such as chip resistors, capacitors, etc. |
| Rectangular nozzle | The rectangular nozzle is suitable for picking up and placing rectangular electronic components, such as IC chips, diodes, etc. |
| Needle nozzle | Needle nozzle is suitable for picking up and placing elongated electronic components, such as inductors, crystal oscillators, etc. |
| V-shaped nozzle | V-shaped nozzle is suitable for picking up and placing special-shaped electronic components, such as LED lamp beads, optocouplers, etc |
In addition, there are some special types of nozzles, such as rotating nozzles, elbow nozzles, etc., which can be selected and used according to specific placement requirements. It should be noted that different nozzles are suitable for electronic components of different sizes and shapes. Choosing the appropriate nozzle type is very important for the efficiency and quality of placement work.
The shape of the suction nozzle includes square hole, round hole, V groove, etc. Custom-made suction nozzles generally select flat suction points based on the shape of the material. Some are made into elongated suction nozzles that extend into the groove of the material to absorb them flatly. Some are made into a return shape based on the edge of the material, and some are made into two-sided suction points. If the ends are flat, if the middle is uneven, a bridge must be built. Some materials are sticky and difficult to put out, so you need to make some grooves in the wall of the suction nozzle or make a rubber head.
During the use of SMT nozzles, attention should be paid to cleaning and maintenance so that the nozzles can be recycled and reduce production costs.
H08M 3.7 nozzle
H08M 7.0 nozzle
H08M 1.8 nozzle
H08M 2.5 nozzle
H02F 10.0G nozzle AA6NF04
H02F 7.0G nozzle AA6NE0
H02F 7.0G nozzle
Reasons why SMT nozzle fails to pick up components
(1) The vacuum negative pressure is insufficient. When the suction nozzle picks up components, a certain negative pressure is generated at the suction nozzle, which adsorbs the components to the suction nozzle. To determine whether the components picked up by the suction nozzle are abnormal, the negative pressure detection method is generally used. When the negative pressure When the sensor detection value is within a certain range, the machine considers the suction to be normal, otherwise it considers the suction to be poor.
(2) The suction nozzle is worn. The deformation, blockage, and damage of the suction nozzle cause insufficient air pressure, causing the component to be unable to be sucked. Therefore, the degree of wear of the suction nozzle must be regularly checked and serious ones must be replaced.
(3) Influence of the feeder, the feeder feeds poorly (the feeder gear is damaged), the material belt hole is not stuck on the feeder gear, there are foreign objects under the feeder, the circlip is worn), the pressure belt The cover, spring and other operating mechanisms may be deformed, rusted, etc., which may cause components to be sucked sideways, stand up, or cannot be sucked. Therefore, regular inspections should be carried out and problems should be dealt with in a timely manner to avoid a large amount of waste of components.
(4) Influence of suction height. The ideal suction height is when the nozzle of the placement machine contacts the surface of the component and then presses down 0.05mm. If the depth of the depression is too large, the component will be pressed into the trough instead. Can't afford the material. If the suction condition of a certain component is not good, the suction height can be adjusted slightly upward, such as 0.05mm.
(5) Problems with incoming materials. There are quality problems in the chip component packaging produced by some manufacturers. For example, the gap between the perforations is large, the adhesion between the paper tape and the plastic film is too large, and the size of the material trough is too small. Possible reasons for not being able to pick it up
