Brand Name: | JUKI |
Model Number: | 504 |
MOQ: | 5pc |
Price: | Negotiable |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 10000 pcs per month |
JUKI Nozzle 504 for 2000 Series SMT Pick and Place, Tungsten Steel
Introduction
This JUKI 504 nozzle used for JUKI 2000 series Chip Mounter, for SMD pick and place, it's made of high quality Ceramic, Tungsten Steel and Rubber.
Specifications
Brand | JUKI |
Usage | SMD Chip Mounter |
Suction hole | Single |
Nozzle base | Tungsten steel |
Parts number | E36037290A0 |
Nozzle type | 504 |
Chip mounter | 20000series |
Nozzle size | 31x16mm / 1.22 x 0.63 inch(Height x Diameter) |
Nozzle color | Sliver and green |
Material | Tungsten steel+rubber+ceramic |
Weight | 8g/0.353 ounces |
Package | Customized Blister and carton box |
Features
1, Using high quality materials, ceramic, tungsten steel and rubber, better mounting performance and long lifespan.
2, The nozzles are well packed by the customized blister, won't be broken during the shipment.
3, Standard size without any error, high precision.
4, Green and slive color designed, good appearance and environment protected.
5, Suitable for Component suction and placement, like cathode capacitance, diode, SOT, QFN, BGA and so on.
JUKI 2000 Series nozzle models
E36087290A0 JUKI NOZZLE 500 ASSY.1.0×0.5
E36007290A0 JUKI NOZZLE 501 ASSEMBLY 0.7×0.4
E36017290A0 JUKI NOZZLE 502 ASSEMBLY O 0.7/O 0.4
E36027290A0 JUKI NOZZLE 503 ASSEMBLY O 1.0/O 0.6
E36037290A0 JUKI NOZZLE 504 ASSEMBLY O 1.6/O 1.0
E36047290A0 JUKI NOZZLE 505 ASSEMBLY O 3.5/O 1.7
E36057290A0 JUKI NOZZLE 506 ASSEMBLY O 5.0/O 3.2
E36067290A0 JUKI NOZZLE 507 ASSEMBLY O 8.5/O 5.0
E36077290A0 JUKI NOZZLE 508 ASSEMBLY O 9.5/O 8.0
SMT production line equipment
1. Universal SMT machine: Using the program edited by the device to mount components onto designated parts positions, it can mount SOP 28 pin or more (including components that can be mounted by high-speed machines) roll, disc, or tubular packaging components. Its characteristics are high precision and diversity, but its installation speed is inferior to high-speed machines.
2. Reflow soldering: Use SMT solder paste or red glue to set an appropriate temperature curve to complete the soldering action between the solder paste and the part.
3. Unloader: The board is loaded into the magazine through a transfer track.