Brand Name: | JUKI |
Model Number: | JUKI 508 KE2000 series |
MOQ: | 5pc |
Price: | Negotiable |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 10000 pcs per month |
SMT Nozzle JUKI 508 for JUKI2000 Pick and Place Machine Ceramic Tungsten Steel
Specifications
Material | Ceramic+Tungsten steel+Rubber |
Brand | JUKI |
Chip mounter | KE2000series |
Nozzle type | 508 |
Nozzle size | 3.1 x 1.6cm/1.22 x 0.63 inch(Height x Diameter) |
Nozzle color | Sliver and green |
Weight | 8g |
Package | Blister and carton |
Features
1, Each nozzle has a unique Manufacturing Part Number label on the inner blister package that proves it has been qualified,
which include Part Number,model Number and inspection date information.
2, We also can customized for you, if you have any questions about the item,please provide us the manufacturering information.
3, The nozzle is made of Ceramic, Tungsten Steel and Rubber.
4, Green and slive color, good appearance.
5, Suitable for Component suction and placement, like cathode capacitance, diode, SOT, QFN, BGA and so on.
6, Nozzle Type is 508, compatible with JUKI2000 Series chip mounter.
JUKI Nozzle 2000 Series
E36087290A0 JUKI NOZZLE 500 ASSY.1.0×0.5
E36007290A0 JUKI NOZZLE 501 ASSEMBLY 0.7×0.4
E36017290A0 JUKI NOZZLE 502 ASSEMBLY O 0.7/O 0.4
E36027290A0 JUKI NOZZLE 503 ASSEMBLY O 1.0/O 0.6
E36037290A0 JUKI NOZZLE 504 ASSEMBLY O 1.6/O 1.0
E36047290A0 JUKI NOZZLE 505 ASSEMBLY O 3.5/O 1.7
E36057290A0 JUKI NOZZLE 506 ASSEMBLY O 5.0/O 3.2
E36067290A0 JUKI NOZZLE 507 ASSEMBLY O 8.5/O 5.0
E36077290A0 JUKI NOZZLE 508 ASSEMBLY O 9.5/O 8.0
SMT production line equipment:
1. SMD machine: the use of equipment edited by the program will be components mounted on the designated parts position, can be mounted SOP 28pin or more (including high-speed machine can be mounted components) rolls, discs or tubes of packaging components. Characterised by high mounting accuracy, diversification, but the mounting speed is inferior to high-speed machines.
2. Reflow soldering: SMT solder paste or red glue using the temperature to set the appropriate temperature profile so that the solder paste and parts to complete the welding action.
3.Unloader: Through the transmission track, the board is collected in the magzine.