Brand Name: | JUKI |
Model Number: | JUKI 502 KE2000 series |
MOQ: | 5pc |
Price: | Negotiable |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 10000 pcs per month |
Ceramic Rubber SMT JUKI Nozzle 502 for JUKI Chip Mounter 2000 Series Machine
Introduction
This 502 nozzle is the high quality copy new nozzles for replacing the old nozzles in the chip mounter, to achieve better mounting performance,
it's totally same as the original, which can replace easily and convenient.
Specifications
Brand | JUKI |
Chip mounter | KE2000series |
Nozzle type | 502 |
Nozzle size | 3.1 x 1.6cm/1.22 x 0.63 inch(Height x Diameter) |
Nozzle color | Sliver and green |
Material | Ceramic+Tungsten steel+Rubber |
Weight | 8g |
Package | Blister and carton |
Features
1, Using high quality materials, ceramic, tungsten steel and rubber, to achieve better mounting performance.
2, The nozzles are well packed by the blister, won't be broken during the shipment.
3, Standard size without any error.
4, Green and slive color, good appearance.
5, Suitable for Component suction and placement, like cathode capacitance, diode, SOT, QFN, BGA and so on.
JUKI Nozzle 2000 Series
E36087290A0 JUKI NOZZLE 500 ASSY.1.0×0.5
E36007290A0 JUKI NOZZLE 501 ASSEMBLY 0.7×0.4
E36017290A0 JUKI NOZZLE 502 ASSEMBLY O 0.7/O 0.4
E36027290A0 JUKI NOZZLE 503 ASSEMBLY O 1.0/O 0.6
E36037290A0 JUKI NOZZLE 504 ASSEMBLY O 1.6/O 1.0
E36047290A0 JUKI NOZZLE 505 ASSEMBLY O 3.5/O 1.7
E36057290A0 JUKI NOZZLE 506 ASSEMBLY O 5.0/O 3.2
E36067290A0 JUKI NOZZLE 507 ASSEMBLY O 8.5/O 5.0
E36077290A0 JUKI NOZZLE 508 ASSEMBLY O 9.5/O 8.0
SMT production line equipment:
1. SMD machine: the use of equipment edited by the program will be components mounted on the designated parts position, can be mounted SOP 28pin or more (including high-speed machine can be mounted components) rolls, discs or tubes of packaging components. Characterised by high mounting accuracy, diversification, but the mounting speed is inferior to high-speed machines.
2. Reflow soldering: SMT solder paste or red glue using the temperature to set the appropriate temperature profile so that the solder paste and parts to complete the welding action.
3.Unloader: Through the transmission track, the board is collected in the magzine.